Epoxi Liima L ja kovettaja L
Soveltuu hyvin käytettäväksi hiilikuidun, lasikuidun, aramid ja muiden kuitujen kanssa.
Työskentelyaika: 40 minuuttia (100g /20C)
Epoxy resin L + Kovetin L (40min) 140g
Epoxy Resin L and Hardener L
The resin system Epoxy Resin L + Hardener L yields superior impregnating and wetting properties towards carbon, glass, aramid and natural fibres.
- Low viscosity
- Highly transparent
- High degree of UV stability
- Tack-free curing even of thin layers
- Glass transition temperature (Tg) max. 76 °C (post-curing at 60 °C / 15 h)
- High static and dynamic strength
- Free of nonylphenol and DETA
Processing time: 40 minutes (100 g / 20 °C)
100 : 40 parts by weight resin : hardener
100 : 45 parts by volume resin : hardener
It exhibits a very good price/performance ratio and is suitable for the following processing procedures:
- Hand laminating
- Vacuum moulding
- Press moulding
Expertise for the resin system Epoxy Resin L + Hardener L: this system is not cytotoxic (cell damaging), important for applications in medical purposes.
Mechanical properties (Neat resin after curing)
Flexural strength (DIN EN ISO 178): 111 MPa
Flexural modulus (DIN EN ISO 178): 2.960 MPa
Tensile strength (DIN EN ISO 527): 69 MPa
Elongation at break: 4.7 %
Compressive strength (DIN EN ISO 1426): 91 MPa
General information about the system "Epoxy Resin L" with Hardeners S, L, CL, EPH 500, EPH 161, W 300, GL 1 and GL 2
- Low viscosity, free of solvents and fillers
- Fast impregnation of glass, aramid, carbon and natural fibres
- High static and dynamic strength (GL approval with the Hardeners GL 1 and GL 2 being present
Epoxy Resin L with the corresponding Hardeners S, L, CL, EPH 500, EPH 161, W 300, GL 1 and GL 2 is the most commonly used laminating and adhesive resin in R&G`s delivery programme.
In conjunction with the Hardeners S (15 minutes), L (40 minutes), CL (60 minutes), EPH 500 (60 minutes), EPH 161 (90 minutes), W 300 (300 minutes), GL 1 (30 minutes) and GL 2(210 minutes), this epoxy resin exhibits similar mechanical properties to those of the laminating systems usual aerospace .Its heat deflection temperature reaches from 60 °C (S, L, EPH 500, W 300), to 80 °C (GL 1 and GL 2, after post-curing), to 95 °C (CL, after post-curing) and finally to 120 °C (EPH 161, after post-curing).
Its low surface tension, good adhesion, and minimal curing shrinkage makes the Epoxy Resin L ideal for bonding wood, metal, foamed polystyrene like Styropor® etc. It can be processed in all of the customary methods, e.g. hand lay-up, pressure and vacuum impregnation, press moulding and filament winding.